- Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysisel febrero 28, 2024 a las 12:00 am
AbstractFor the first time, finite element analysis (FEA) is applied to the thermal-compression flip-chip process in micro-electronics. By adding the bump height nonuniformity and the morphology variance, a common basal line is established. Although the experiment confirms the rate dependence of indium, an approximation is made to derive the material properties in FEA. The relative standard deviation (RSD) of deformation between the FEA model and the reality is around 1% when predicting the misaligned flip-chip specimen. Besides, the modeled bump characteristic with misalignment coincides with the cross-sectional scanning electron microscope (SEM) picture. The model could be served as a powerful tool to guide the manufacturing process.
- Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platformel febrero 28, 2024 a las 12:00 am
AbstractTo meet the requirements of high-precision motion control for optoelectronic packaging platforms, we propose an improved particle swarm optimization (PSO) and backpropagation (IPSO-BP) neural network for solving the forward kinematics problem (FKP) of platforms. The focus of this paper is the 6-pss flexible parallel platform commonly used in optoelectronic packaging. First, a platform inverse kinematics problem (IKP) based on a flexibility matrix is solved using geometric and vector analysis. The conventional PSO-BP network is then optimized utilizing uniform design (UD), a random learning strategy, and space reduction techniques in FKP. Finally, simulations and experiments demonstrate that the proposed IPSO-BP network for solving the FKP on high-precision optoelectronic packaging platforms is feasible. Compared to BP and PSO-BP, this network has a higher resolution, faster convergence speed, and error control at the submicron level, which satisfies the motion control requirements of the platform at the micron level. This study lays a solid foundation for the production of high-quality devices in optoelectronic packaging.